FCBGA (Flip Chip Ball Grid Array) is a type of semiconductor packaging that offers several design characteristics and applications. It utilizes flip chip bonding, where the active side of the chip is directly attached to the substrate or PCB. The chip is connected to the external circuitry through a grid of solder balls placed on its underside, forming a ball grid array configuration. FCBGA provides high I/O density due to the compact arrangement of solder balls, making it suitable for applications that require extensive I/O capabilities. Its flip chip design enables efficient heat dissipation, improving thermal management and making it ideal for high-performance applications that generate significant heat. The shorter interconnect lengths and reduced inductance in FCBGA packaging minimize signal delays and enhance electrical performance, making it suitable for high-speed applications. FCBGA is commonly used in consumer electronics, such as smartphones, tablets, and gaming consoles, due to its compact size, high I/O density, and thermal management capabilities.

FCBGA combines flip chip technology with a ball grid array configuration to provide high-density interconnects, improved thermal management, and enhanced electrical performance. It finds applications in microprocessors, graphics processors, networking chips, consumer electronics, and high-speed communication devices.

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RF devices usually use some windings to achieve the effect of capacitance and inductance. What kind of winding can achieve the capacitance and inductance values we need? At this time, professional electromagnetic simulation software must be used to evaluate the capacitance and inductance at the same time. , simulating the filtering, power distribution, coupling and other properties of RF devices.

Trace width changing reference discontinuity layer transformation, dense interconnection,vias, solder balls.roughness, copper and dielectric loss in the design all affect the transmission, refection and crosstalk. Briefly speaking the physical design affects performance of interconnection directly.Professional EM tool to evaluate the physical design and judge the performance of interconnection.

Whether it is chip design, package design or PCB design, the internal signal interconnection and power supply network are very complex. These interconnections have certain parasitic resistance, inductance and capacitance effects. It is precisely because of the existence of these parasitic effects that the signal is in the During transmission, error transmission is prone to occur.

Application

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Electronic heat dissipation refers to the effective thermal management of chip packaging, PCB systems and electronic equipment, so as to ensure the normal operation of electronic equipment; electronic heat dissipation design is an important part of electronic structure design, and it will be an important factor restricting electronic structure design. , is also an important indicator of whether the electronic structure design is reasonable; the output value of the electronic cooling industry is growing at an average annual growth rate of more than 20%, and it is an industry of tens of billions of dollars.

Features

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The Chiplet and FCBGA Package are placed on a 4-layer standard PCB to simulate the temperature distribution of the whole system. The main calculations contain the temperature distribution of FCBGA details and the maximum / minimum temperature inside the package. The difference between the calculated maximum temperature and the measured maximum temperature is no more than 2 ℃

The power chip is connected to the 4-layer PCB circuit boardreleasing a Die surface heat source(1W).The whole system is placed in a large space for natural convection heat transfer, and the temperature distribution is calculated Compared with the actual test results, the error is not more than 1℃。

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Features

Today, with the increasingly strong market demand for electronic products, people have higher and higher requirements for the performance and functions of electronic products, which has pushed up the rapid growth of electronic product technology, and the IC process is getting smaller and smaller. More and more, the signal turnover speed is getting faster and faster, but the core voltage is getting lower and lower, the current consumption is getting bigger and bigger, the CPU core voltage, IO voltage, DRAM voltage, etc., and the types of DC power supply are becoming more and more diverse. These factors make the power integrity problem more and more prominent, and the electronic product design process is full of challenges.

Our DC simulation software is based on powerful circuit model modeling technology, high-precision mesh division and accurate and efficient simulation solution algorithm, to realize the user's power supply DC simulation analysis of chip packaging, PCB and other electronic equipment. Current simulation software for PCB and packaged products provides comprehensive DC analysis.

On the 4-layer PCB board. a FCBGA package chip is connected to perform DC simulation analysis of the whole system. Check IR drop,current density distribution,hot spot distribution.

For the PCB board with more complex Components models, simulate multiple power supply networks together extract Power tree, analyze via current density.