Advanced IC Substrates, HDI PCBs & Packaging Solutions
From substrate design, simulation and fabrication to IC packaging, testing and hardware integration, C&C support high-performance semiconductor and electronic system projects.
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High-Speed PCBs for 800G / 1.6T Optical Modules
We support high-density, low-loss and impedance-controlled PCB manufacturing for next-generation optical communication, AI data centers and high-speed networking applications.
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Professional IC Substrate Manufacturing and One-stop Services
First-class professional IC substrate manufacturing, design, simulation and hardware one-stop solution provider.
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